| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TPS73633DRBR | 电源IC |
TI/德州仪器 |
22 |
22+ |
10000 |
|||
| TPS2069DDBVR | TI/德州仪器 |
12000 |
||||||
| NJM2591V-TE1 | IC |
JRC/新日本无线 |
2000 |
|||||
| PIC16F639-I/SS | IC |
MICROCHIP/微芯 |
08 |
300 |
||||
| L6390DTR | IC |
ST/意法 |
22 |
10000 |
||||
| UPD720114GA-YEU-AT | IC |
RESE |
20+ |
1250 |
||||
| SM6T33CA | IC |
ST/意法 |
12500 |
|||||
| TS5A23166DCUR | 模拟IC |
TI/德州仪器 |
15000 |
|||||
| TLJR336M010R3500 | 钽电容 |
AVX |
100000 |
|||||
| TLJR226M010R3800 | 钽电容 |
AVX |
100000 |
|||||
| RRC2054-2 | IC |
PRC |
10000 |
|||||
| TRJA475K016RRJ | IC |
AVX |
100001 |
|||||
| MT25QU128ABA1ESE-0SIT | IC |
AEROSEMI/航天民芯 |
21 |
7500 |
||||
| TPS53513RVER | 电源IC |
TI/德州仪器 |
15 |
2012 |
||||
| LPC1830FET | IC |
LPX |
18+ |
3600 |
||||
| BSC077N12NS3G | IC |
bs |
20+ |
22000 |
||||
| TPS2553QDBVRQ1 | 贴片二极管 |
TI/德州仪器 |
17+ |
5100 |
||||
| LPC3131FET | IC |
LPC |
10+ |
3000 |
||||
| 74LVC3G07GN,115 | IC |
NXP/恩智浦 |
2400 |
|||||
| STM32F412RGT6 | 32位MCU |
ST/意法 |
19 |
20000 |
||||
| MCGLR35V476M6.3X11 | IC |
SPC |
2020 |
700 |
||||
| W25Q16JVSSIQ | IC |
WINBOND/华邦 |
OMRON |
20+ |
14000 |
|||
| MLX90333KDC-BCT-000-TU | 存储IC |
MLX |
2017 |
38 |
||||
| TAJB106K016RNJ | IC |
AVX |
21+12 |
50000 |
||||
| M24M01-RMN6TP | EEPROM存储器 |
ST/意法 |
20+ |
30000 |
||||
| MAX8840ELT18+T | IC |
MAXIM/美信 |
2017 |
80000 |
||||
| IKCM15L60GD | IC |
INFINEON/英飞凌 |
2147 |
5000 |
||||
| T75R03DIV-F | IC |
EXAR/艾科嘉 |
1603 |
45 |
||||
| UCC2813DTR-4 | IC |
TI/德州仪器 |
1851 |
1927 |
||||
| SH9SD004GSMIBSI01 | IC |
SAMSUNG/三星 |
1733 |
100 |